AMAOE U-SMU4 BGA Reballing Stencil for Samsung Exynos E9955 /E8835 / E8535 / E8855 / E8845 /E9945 CPU & RAM (0.12mm
Product Title
AMAOE U-SMU4 BGA Reballing Stencil for Samsung Exynos E9955 /E8835 / E8535 / E8855 / E8845 /E9945 CPU & RAM (0.12mm)Short Description (For Product Summary)
AMAOE U-SMU4 BGA Reballing Stencil for Samsung Exynos 2500 / 2400 / 1580 / 1480 / 1380 / 1330 CPU & RAM (0.12mm)Short Description (For Product Summary)
Professional AMAOE U-SMU4 (0.12mm) UBGA reballing stencil designed specifically for newer Samsung Exynos series processors and RAM. Features an anti-bulging heat-dissipation hole design for fast, accurate, and warp-free BGA IC reballing.
Brand: AMAOE (A-Mao Easy Repair)
Model: U-SMU4
Thickness: 0.12mm
Product Code: 41012612
Supported Chips: Exynos 2500, Exynos 2400, Exynos 1580, Exynos 1480, Exynos 1380, Exynos 1330, RAM 496
Full Product Description
Overview The AMAOE U-SMU4 is a precision-engineered 0.12mm stainless steel BGA reballing stencil tailored for Samsung smartphones powered by mid-range and flagship Exynos processors. Built under AMAOE’s UBGA Reballing Expert Series, this stencil includes surrounding thermal vent holes to prevent stencil deformation (bulging) under high hot-air temperatures, ensuring uniform solder ball formation every time.
Supported IC & CPU Models (Stencil Layout)
Exynos 2500 / S5E9955 (E9955) – Upper Layer / Main CPU Pattern
Exynos 2400 / S5E9945 (E9945) – (Samsung Galaxy S24 / S24+ / S24 FE)
Exynos 1380 / S5E8835P (E8835P) – (Samsung Galaxy A54 5G / M54 / F54 / A35 5G)
Exynos 1330 / S5E8535P (E8535P) – (Samsung Galaxy A14 5G / M14 5G / F14 5G)
Exynos 1580 / S5E8855 (E8855) – (Samsung Galaxy A56 5G)
Exynos 1480 / S5E8845 (E8845) – (Samsung Galaxy A55 5G)
RAM 496 – BGA496 Mobile RAM IC
Exynos 2500 / S5E9955 (E9955) – Alternate / Secondary CPU Pattern
Key Features
Optimal 0.12mm Thickness: Provides the ideal solder paste volume for fine-pitch Samsung Exynos CPU and RAM pads without bridging.
Anti-Bulging Thermal Vent Design: Strategically placed heat-dissipation holes around each IC template distribute heat evenly and prevent the steel mesh from warping during hot-air reflow.
Laser-Cut Precision: High-accuracy square and round aperture openings allow smooth stencil release and uniform solder ball sizes.
Multi-Chip Convenience: Combines 7 essential modern Samsung Exynos CPUs and RAM configurations onto a single workspace-saving plate.
Technical Specifications
Specification | Details |
Brand | AMAOE (阿毛易修) |
Model Number | U-SMU4 |
Series | UBGA Reballing Expert Series |
Stencil Thickness | 0.12mm |
Barcode / SKU ID | 41012612 |
Patent Number | ZL2016213989365 |
Application | Samsung Exynos Mobile Motherboard CPU & RAM Reballing |
SEO Tags / Keywords (For WooCommerce)
AMAOE U-SMU4, U-SMU4 Stencil, Exynos 2500 Stencil, Exynos 2400 Stencil, Exynos 1580 Stencil, Exynos 1480 Stencil, Exynos 1380 Stencil, Exynos 1330 Stencil, E9955 Stencil, E9945 Stencil, E8855 Stencil, E8845 Stencil, E8835P Stencil, E8535P Stencil, RAM 496 Stencil, Samsung CPU BGA Stencil, AMAOE 0.12mm Stencil, 41012612
SMU4
U-SMU4 Stencil
2026-01-24 A-Mao Repair
Exynos 2500/E9955, Exynos 2400/E9945, Exynos 1380/E8835P, Exynos 1330/E8535P, Exynos 1580/E8855, Exynos 1480/E8845, RAM 496, Exynos 2500/E9955
