AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400
Product Title Options
- Standard E-Commerce Title: AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – Kirin 9020 / 9000S / 8000, Apple A18 / A18 Pro / SE3-A15, Dimensity 8400
- Short Title: AMAOE U-MIXU2 Multi-Brand CPU BGA Stencil (0.12mm)
Product Overview
The AMAOE U-MIXU2 is a professional-grade, 0.12mm BGA reballing stencil engineered for precision motherboard repair across Huawei (Kirin), Apple (A-Series), and MediaTek (Dimensity) flagship processors. Part of AMAOE’s UBGA Expert Series, this 8-in-1 hybrid stencil features an advanced heat-dissipation perforation layout designed to prevent warping and bulging under high hot-air temperatures, ensuring uniform solder ball formation on the first pass.
Key Features
- 8-in-1 Multi-Brand Compatibility: Combines popular Huawei Kirin, Apple iPhone, and MediaTek Dimensity CPU and RAM patterns onto a single work plate.
- Anti-Drum / Anti-Bulge Thermal Design: Integrated surrounding vent holes equalize thermal expansion during heating, preventing the stencil from arching or lifting off the IC.
- Optimal 0.12mm Thickness: Balances structural rigidity with precise solder paste volume for fine-pitch mobile SoC pads.
- Laser-Cut Precision: Clean, burr-free square and round apertures allow smooth stencil release without dragging or bridging solder balls.
Supported ICs & Slot Layout
| Slot # | Label on Stencil | Chipset / Component Details |
| 1 | 麒麟Kirin9020-Hi36C0 | Huawei HiSilicon Kirin 9020 CPU (Hi36C0) |
| 2 | SE3-A15 | Apple iPhone SE (3rd Gen) A15 Bionic CPU |
| 3 | A18 | Apple A18 Bionic CPU |
| 4 | A18 Pro (printed as A18 Rro) | Apple A18 Pro Bionic CPU |
| 5 | 天玑8400-MT6899Z | MediaTek Dimensity 8400 CPU (MT6899Z) |
| 6 | RAM496 | 496-Ball Mobile LPDDR RAM Package |
| 7 | 麒麟Kirin8000-Hi6290 V110 | Huawei HiSilicon Kirin 8000 CPU (Hi6290 V110) |
| 8 | 麒麟Kirin9000S-Hi36A0-V120 | Huawei HiSilicon Kirin 9000S CPU (Hi36A0 V120) |
Technical Specifications
- Brand: AMAOE (阿毛易修)
- Series: UBGA Reballing Expert Series (UBGA-植锡专家系列)
- Model: U-MIXU2
- Type: Hybrid CPU Collection Stencil (混合-CPU 集合网)
- Thickness: 0.12mm
- Patent Number: ZL2016213989365
- Barcode / SKU Reference: 41011879
SEO Tags & Keywords
AMAOE U-MIXU2, U-MIXU2 Stencil, Kirin 9020 Stencil, Hi36C0 BGA Stencil, Kirin 9000S Hi36A0 V120, Kirin 8000 Hi6290 V110, Dimensity 8400 MT6899Z Stencil, iPhone 16 A18 Pro BGA Stencil, iPhone SE3 A15 Stencil, RAM496 Stencil, 0.12mm CPU Reballing Stencil, 41011879
U-MIXU2_Stencil
2025-03-12 A-Mao Repair
Kirin 9020 - Hi36C0 (SE3-A15, A18, A18 Pro)
Dimensity 8400 - MT6899Z (RAM496); Kirin 8000 - Hi6290 (V110); Kirin 9000S - Hi36A0 (V120)
